196 Semiconductor jobs in India

Overview:
You don't have to be an employee long before you understand the SSOE difference. It goes back to our history of reinventing ourselves for new markets, serious rates of growth year after year, and being ahead of the curve in technology. Those are the achievements of a company that rewards talent and effort in ways that mean the most to the individual.

When you work at SSOE, you work with the best and you're a part of something bigger than yourself. And providing the best possible workplace for our employees gives us a competitive advantage-helping us attract and retain top talent and drive better business results.

**Responsibilities**:
Electrical Designer with strong AutoCAD experience (2D) to design Schematics with power and interconnects, grounding, perform arc flash calculations, cable trays or wireway sizing, for the semiconductor/chip manufacturing industry. This group performs high volume and turns around packages quickly to meet schedules. The Design Engineer / Designer will perform design as well as help build a team locally to support design remotely by coaching and working with other designers and engineers in local office.

**Responsibilities**

Design Tool Installation packages. Packages to include Schematics, Facility Data information, General Routing, and Details.
- Create Schematic to show tool components (Fab / Subfab) design power, interconnect routing, size cabletray or wireway for interconnects, size conduits, circuits.
- Develop fab/Subfab partial plans for electrical routing and elevation details as required.
- Create custom details as required.
- For each facility panel power circuit:

- Calculate voltage drop at the point of power source connection to each tool (or receptacle) and to each tool support component (or receptacle). Ensure voltage drop is within limits defined in the Tool Install Design Standards.
- Calculate available fault current at the point of power source connection to each tool (or receptacle) and to each tool support component (or receptacle). Ensure available fault current is less than the load equipment (or receptacle) short circuit current rating.
- Evaluate available fault current at the facility panel circuit breaker for each tool (or receptacle) and for each tool support component (or receptacle). Ensure that the branch circuit breaker interrupting capacity rating (AIC) is greater than the available fault current.
- Evaluate terminal conductor provisions for each tool (or receptacle) and for each tool support component (or receptacle). Ensure conductor type and size is correct for terminal provisions.
- Where the calculated Arc Flash Personal Protective Equipment (AF PPE) Levels are one or above at tool power circuit loads or devices, model and propose options for reducing the AF PPE Level to zero.
- For each raceway and cable tray:

- Calculate conductor/cable/bundle fill. Ensure fill meets NEC requirements.
- Evaluate conductor/cable connector dimensions and geometry. Ensure raceways are sized to accommodate fixed connectors.
- Evaluate conductor/cable insulation voltage rating. Ensure insulation voltage rating for circuit grouping meets NEC requirements.
- Evaluate circuit classification. Ensure circuit grouping meets NEC separation requirements.
- Where raceways or cable trays are electrically discontinuous, determine equipment bonding conductor size to meet NEC requirements.
- Evaluate wire bending space within wireway. Ensure that maximum conductor/cable size within the wireway meets UL 870 requirements.
- For excess cable storage boxes:

- Calculate minimum box height and width dimensions to meet bending radius requirements of the contained-conductor/cable/bundle.
- Calculate minimum box depth dimension to meet fill requirements of the contained conductor/cable/bundle per Tool Install Design Standards.
- Determine minimum box depth dimension to facilitate wireway termination.
- For all power and Class 1 circuits:

- Calculate conductor/cable and device ampacity. Ensure conductor/cable and device ampacity meets NEC requirements.
- Calculate conductor/cable and device overcurrent protective device (OCPD) rating. Ensure conductor/cable and device is protected by the OCPD per NEC requirements.
- Determine the equipment grounding conductor size for each circuit based on NEC requirements.
- For separately-derived systems (e.g., transformers):

- Calculate the Grounding Electrode Conductor (GEC) size per Tool Install Design Standards.
- For each tool and each tool support component where electrical working spaces (electrical clearances) are identified by the supplier and/or Intel, validate the dimensions of the electrical working spaces based on the maximum exposed circuit voltage.
- Designer will coordinate work with local designers / engineers
- Designer will answer RFI’s and update drawings for Record Drawings.
- Designer may need to develop designs from supplier data (First of a Kind designs).
- Will work with other Designers and Engineers on

**Introduction**
As a Hardware Developer at IBM, you'll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today's market.
**Your role and responsibilities**
Overview:
Join IBM's elite product development team driving innovation across IBM Z, POWER Systems, Storage and Quantum. We are seeking a skilled mechanical modeler with a strong background in simulation, design, and hardware validation to support high-performance and high-reliability server solutions.
Role Summary:
As a Mechanical Modeler, you will design and optimize module and server hardware systems to meet stringent thermal and mechanical requirements. You'll collaborate across disciplines to ensure designs meet performance, reliability, safety, and manufacturability standards. This role involves simulation, lab testing, and providing actionable insights to guide engineering decisions.
Key Responsibilities:
* Develop and simulate system-level hardware models using CAD and FEA tools.
* Acquire or collaborate to obtain accurate material properties for modeling.
* Analyze qualification test data and validate against simulation results.
* Prepare detailed technical reports and presentations for stakeholders.
* Provide design guidelines for components such as laminates, TIMs, coolers, chips, GPUs, HBMs, and load actuation hardware.
* Influence design decisions to ensure robust packaging and system integration.
* First-level packaging (chip, laminate, module) and module-to-socket integration.
**Required technical and professional expertise**
* Master's/PhD in Mechanical Engineering.
* 3+ years of experience in Finite-Element Modeling (FEM).
* Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus).
* Ability to create scripts (APDL, Python) beyond GUI modifications.
* Experience in design for manufacturability (DFM).
* Hands-on lab experience.
* Strong communication, problem-solving, and time management skills.
* Ability to work independently and in cross-functional teams.
* Familiarity with electronic packaging and heterogeneous integration.
**Preferred technical and professional experience**
* 5+ years in mechanical modeling.
* Experience in static structural FEA (stress, strain, warpage prediction).
* Moisture diffusion and swelling simulation expertise.
* Knowledge of server/computer architecture.
* Experience with lab tools: tensile testers (Instron/MTS), DMA, TMA, TGA.
* Applied statistics and DOE knowledge (Minitab, JMP).
* Programming experience in Matlab, Python, LabView, or C++.
IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

**Introduction**
As a Hardware Developer at IBM, you'll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today's market.
**Your role and responsibilities**
About the Team:
Join a world-class product development organization at IBM, driving innovation across IBM Z and POWER System servers, Storage and Quantum. The Thermal and Mechanical Design team is seeking a skilled professional in thermal modeling with hands-on experience in building, testing, and validating thermal solutions. You'll be part of a multidisciplinary team developing high-performance, high-reliability server hardware.
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Role Overview:
As a Thermal Modeler, you will design and optimize IBM module and server hardware systems to meet thermal and mechanical requirements. You'll collaborate with cross-functional teams to ensure designs meet performance, safety, and manufacturability standards. Your work will involve simulation, validation, and providing actionable insights to guide engineering decisions.
Key Responsibilities:
* Develop steady-state and transient CFD-based thermal models using CAD and FVM tools.
* Acquire and analyze material properties to enhance model accuracy.
* Validate simulation predictions through lab testing and data analysis.
* Prepare detailed reports and presentations for stakeholders.
* Provide design guidelines for thermal hardware components including laminates, TIMs, cold plates, chips, GPUs, HBMs, and actuation hardware.
* Influence design decisions to ensure robust thermal solutions for IBM server systems.
**Required technical and professional expertise**
* Master's or PhD in Mechanical Engineering with a focus on Thermal or Structural Mechanics.
* 3+ years of experience in FEM and/or CFD.
* Proficiency in CAD tools (SolidWorks preferred) and simulation tools like Ansys.
* Experience with lab tools and design for manufacturability.
* Strong communication, problem-solving, and time management skills.
* Ability to work independently and in cross-functional teams.
**Preferred technical and professional experience**
* 5+ years of experience in thermal modeling and FEA/FVM using tools like FloTherm, SixSigmaET (Celsius), Ansys IcePak, or Fluent.
* Experience in structural FEA for stress, strain, and warpage prediction.
* Knowledge of moisture diffusion and swelling simulations.
* Familiarity with server and computer architecture.
* Expertise in thermal management of microelectronic packages.
* Hands-on experience with lab tools such as laser flash conductivity and DSC.
* Proficiency in applied statistics and DOE using tools like Minitab or JMP.
* Programming experience in MATLAB, Python, LabVIEW, or C++.
IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.